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来源:百度知道 编辑:UC知道 时间:2024/06/05 23:44:18
The thermal embossing process was carried out using a
PDMS transfer mould cast from a silicon master mould.
This master mould was fabricated by exposing the test pattern
(sets of 1 μm × 3 cm parallel lines) through a chrome
on quartz mask into a photoresist layer. Following development
the pattern was etched into the silicon by reactive
ion etching. The ZnO sol–gel was dispensed on to the
glass substrate and covered by the PDMS mould. The
sol–gel was then thermally cured under vacuum in a Heraeus
vacuum oven for 3 hours at 70 °C. The sol–gel microstructure
was then detached from the PDMS mould and
crystallization annealed at a heating rate of 5 °C/min to a
final temperature of 450 °C. All samples were maintained
at this temperature for 1 hour before being air-cooled to
room temperature.

热压花工艺进行了
模具和PDMS转移硅模具。主人
这是主人的模具制作的考试模式
1μm×(套)通过3厘米的平行线铬
石英罩成胶层。下列开发
这个模式被刻在了硅无功
离子刻蚀。摘要在对溶胶-凝胶四处散播
玻璃衬底,涵盖的PDMS的模具。这个
当时的热溶胶-凝胶法在真空中一流
真空烘箱3小时在70°C。溶胶-凝胶微观结构
就脱离了PDMS模具及吗
结晶退火加热率在5°C /分钟
最终温度的450度。所有的样品
在这个温度为1小时前)。风冷
房间的温度。