UC知道科技英语翻译（万分感激，倾家荡产全部奋献）
来源：百度知道 编辑：UC知道 时间：2024/05/22 03:08:42
本发明提供一种整合性单晶片单元上的半导体电路及其可调性方法与系统，特别涉及一多专案晶圆上的一半导体电路、相关的电路设计以及一调适性系统。该半导体电路包含有至少一标准模组、至少一可重组模组以及至少一连接层。该标准模组具有验证过的功能。可依据一预定设计，该可重组模组可以被程序化，且该标准模组以及该可重组模组可以相互连接。该可重组模组包含有至少一存储模组以及一输出入模组。本发明可以减少完成整个SOC所需要的步骤，也同时减少了要完成原型电路所需要的制程步骤。经过验证原型电路设计之后，正式的产品晶片仅仅需要去除不用的模组，重新安排各个需要模组的位置以及相对应的连接，就可以减少基底面积。
The invention was public a kind of several structure semi-conductor mold piece and it manufacturing method.The purpose lies in:Provide on sowing in to seek an exaltation to bear wet credibility in the meantime, repressed several structure semi-conductor mold piece and its manufacturing method of[with] bent creation.The semi-conductor mold piece(1) is to fold a layer of use resin the bottoms and slices form parts(5) through an alternation but become, the 1 use resin the bottom has the 1st to cover up into the conductor(7), installing semi-conductor chip(2) superficially in the top, the slice's form parts(5) became to receive the openings department(10) of semi-conductor chip(2), the 2nd which has to cover up with the 1st to link into the conductor(7) electricity covers up into the conductor.(9)The semi-conductor mold piece(1) has several form partses(5), in the 1 use resin the bottom of arrange at most lower 1 use resin the bottom(4) is thick in 2 resin 衬 bottom.(3)The slice form