UC知道帮忙翻译一段标准要求
来源：百度知道 编辑：UC知道 时间：2024/06/04 07:57:13
For applications where the hexavalent chromium is not leachable:
A maximum concentration of 1000 ppm by weight and per
homogeneous material shall be tolerated.
Test method: A test for total chromium (for example) can be used to determine that the application is hexavalent chromium free.
For applications where the hexavalent chromium is leachable:
A maximum concentration of 0.1 μg/cm² per homogeneous material
shall be tolerated.
Test method: GMW3034 or DIN 50993-1
Lead in Electronics:
Will be Prohibited in solder and component finishes used in electrical
and electronic components for all parts to be released the first time:
• for vehicle lines as of MY 2009 onwards and
• for powertrain units, safety applications, and applications
requiring additional technical maturity as of MY 2012 onwards.
Long term carryover components may continue to use lead after
2012 until the device is resourced or
A maximum concentration of 1000 ppm by weight and per
homogeneous material shall be tolerated.
Test method: A test for total chromium (for example) can be used to determine that the application is hexavalent chromium free.
For applications where the hexavalent chromium is leachable:
A maximum concentration of 0.1 μg/cm² per homogeneous material
shall be tolerated.
Test method: GMW3034 or DIN 50993-1
Lead in Electronics:
Will be Prohibited in solder and component finishes used in electrical
and electronic components for all parts to be released the first time:
• for vehicle lines as of MY 2009 onwards and
• for powertrain units, safety applications, and applications
requiring additional technical maturity as of MY 2012 onwards.
Long term carryover components may continue to use lead after
2012 until the device is resourced or
为六价的铬不浸出的应用： 1000 ppm的A最大集中由重量的和每
homogeneous材料将被容忍。
Test方法： 总铬的一个测试(例如)可以被用于确定应用是自由六价的铬。
For应用六价的铬浸出的地方： 0.1 μg/cm ²的A最大集中每同类的材料
shall被容忍。
Test方法： GMW3034或DIN 50993-1
在电子的Lead ：
Will在用于电的焊剂和组分结束被禁止 能第一次将发布的所有零件的and电子元件： 车线的•在我2009年向前和 powertrain单位、安全应用和应用的•
requiring另外的技术成熟在我2012年向前。 长期结转额组分也许继续以后使用主角 直到设备的2012 resourced或被重新设计，那时他们
must变得无铅。
This主角排除战略将包括，但是不会被限制： 在被用于的焊剂的a.主角连接组分到电路
board 在涂层的b.主角在连接器导线终端和“pre-solder” 在焊接，起皱等等之前的and组分。 在焊剂的c.主角组分或设备的连接的在a之内的
higher汇编(即马达)