求高手翻译一片英语论文

来源：百度知道 编辑：UC知道 时间：2024/05/16 06:55:38
只是一段英文论文，实在是翻译不出来了，求高手翻译一下：
题目是：Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations

Abstract(摘要)
We have developed a set of methodologies for thermal aware circuit-level reliability analysis with Al or Cu metallization in a circuit layout and implemented it in a public donain reliability CAD tool ,SysRel.SysRel utilizes a hierarchical reliability analysis flow,with interconnect trees treated as the fundamental reliability unit,that sufficiently captures the differences in eletromigration failure between Al and Cu metallizations.Under similar test conditions,the electromigration reliability of Al and Cu interconnect trees demonstrates significant differences because of the differences in interconnect architectural schenes.Using the best estimates of material parameters and an analytical model,we present a detail comparisonof electromigration reliability of a sample test-structure a

题目是：可靠性计算机辅助设计工具，全芯片电分析和比较不同的互连金属化

摘要
我们已经制定了一套方法，热意识到电路级可靠性分析与铝或铜金属化的电路布局和执行它在公共donain可靠性CAD工具， SysRel 。 SysRel采用了分层流动的可靠性分析与互连树视为可靠的基本单位，这充分体现了差异eletromigration失败之间铝和铜 metallizations 。根据类似的试验条件下，电迁移可靠性的铝和铜互连树显示显着性差异，因为不同的互连架构schenes 。采用最好的材料参数的估计和分析模型，提出了比较详细的电迁移可靠性试验样本结构以及实际电路布局与铝和铜双达玛森互连系统。我们也表现出快速热分析SysRel电路性能驱动芯片级可靠性评估。

关键词：计算机辅助设计（ CAD ）;电迁移;可靠性;铝互连;铜互连;热分析。

有的词你是不是拼错了，没有。

题目是：Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations

Abstract(摘要)
We have developed a set of methodologies for thermal aware circuit-level reliability analysis with Al or Cu metallization in a circuit layout and implemented it in a public donain reliability CAD tool ,SysRel.SysRel utilizes a hierarchical reliability analysis flow,with interconnect trees treated as the fundamental reliability unit,that sufficiently captures the differences in eletromigratio