查询论文是否被EI收录
来源:百度知道 编辑:UC知道 时间:2024/05/24 11:29:37
作者是: Hong Zhen Yang, Guo Hong Li, and Xin Yu Cao
单位是:North China Institute of Aerospace Engineering
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检索结果如下:
Accession number: 20094712459585
Title: Study on PoP (Package-on-Package) assembly technology
Authors: Yang, Hong Zhen1 ; Li, Guo Hong1 ; Cao, Xin Yu1
Author affiliation: 1 North China Institute of Aerospace Engineering, Lang fang, He bei, 065000, China
Corresponding author: Yang, H. Z.
Source title: Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
Abbreviated source title: Proc Int Symp Phys Failure Anal Integr Circuits IPFA
Monograph title: Proceedings of the 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009
Issue date: 2009
Publication year: 2009
Pages: 264-267
Article number: 5232653
Language: English
ISBN-13: 9781424439102
Document type: Co