请帮我翻译以下英语，谢谢

来源：百度知道 编辑：UC知道 时间：2024/04/29 14:41:22
the interfacial fracture plays an important role for the reliability of microelectronic packages.cracks of defects may grow and propagate through the corresponding interfaces of the package when it is subjected vibration,high temperature or mechanical loads.the test standard of ASTMD3164,is intended to complement the thick-adherend lap-shear test and extend its application to single-lap-shear adhesive joints employing plastic adherends.in this study,the deformation with respect to the size of crack for pre-cracked underfill and substrate joints (ASTMD3164) under the debonding load was examined.in addition,the mixed mode fracture,were investigated by a dynamic material testing system (MTS810).based on the load-displacement curve,the relationships between the stress intensity factor K(sub)(1),K(sub)(2) and phase angle were obtained.the results appeared that the phase angle decreases with the increase of the ratio of crack length to crack width.

界面断裂起着重要作用的可靠性，微电子packages.cracks缺陷的增长也可能会和宣传，通过相应的接口的软件包时，它是受到振动，高温或机械loads.the测试标准astmd3164 ，目的是为了补充厚粘接圈剪切试验，并扩大其适用，以单圈剪胶接接头雇用塑胶adherends.in这项研究中，变形方面的大小裂缝预裂底与基板伸缩缝（ astmd3164 ）下剥离负荷examined.in此外，这种混合型断裂，被调查的一个动态的材料测试系统（ mts810 ）的基础上，荷载位移曲线之间的关系应力强度因子K （分） （ 1 ） ， K （上分） （ 2 ）及相位角，得到的结果看来，相角随比率增加的裂缝长度，以裂缝宽度。