UC知道哪位好心人能把下面的这段文章翻译一下啊，小弟不胜感激
来源：百度知道 编辑：UC知道 时间：2024/05/28 10:09:55
制程说明
连接层间的铜线路。
工作内容
钻孔完成后，层间的电路并未导通，因此必须要在孔壁上形成一层导通层，藉以连通线路，这个过程一般业界称为 PTH制程，主要的工作程序包括去除胶渣，化学铜和电镀铜三个程序。在去胶渣方面，主要目的是为了清除钻孔中所产生出来的残渣可能对於内部线路所造成的困扰。化学铜方面，主要的目的是在清洁的孔壁表面形成导通的铜薄膜，促使电路板在后续的电镀程序中有良好的导电力，近来也有部分的制造商使用其它的导体，如：石墨或是导电高分子作为介质再作电镀，如：SHADOW就是石墨型的非金属导体制程，实用上已有不错的表现，这类的制程被称为”直接电镀”。全板电镀则是为了加厚孔内的铜厚度所采用的方法，由於此时电路板表面的线路尚未形成，因此这种程序被称为”全板电镀”
太专业了
Plate a bore manufacturing process
Manufacturing process elucidation
Conjunction layer the copper circuit of.
Work contents
After drilling a hole completion, layer the electric circuit of didn't lead, so have to become 1 layer to lead a layer on the bore wall, by with connect circuit, this process general industry is called a PTH manufacturing process, main of work the procedure include to clean a gum residue, chemistry copper with electroplate a copper three procedures.In the aspects of going to a gum residue, main purpose is drill a hole for the sake of the clearance in produce of remnant possibility to the harassment that the internal circuit results in.Chemistry copper aspect, the main purpose is sweeping of the bore wall surface formation lead the copper thin film of, urging circuit board to in follow-uply electroplate the procedure conduct electricity dint goodly, also having part of manufactories to use other conductors recently, such as:G